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data sheet sky 77768 power amplifier module for wcdma/ hsdpa / hsupa/ hspa + / lte C band viii ( 880C 915 mhz) applications ? wcdma handsets ? hsdpa ? hsupa ? hspa + ? lte features ? low voltage positive bias supply 3.2 v to 4.2 v ? good linearity ? high efficiency - 5 0 % at 28.5 dbm ? large dynamic range ? small, low profile package - 3 mm x 3 mm x 0 .9 mm - 10- pad configuration ? power down control ? ingap ? supports low collector voltage operation ? digital enable ? no v ref required ? cmos compatible control signals ? integrated directional coupler description the sky 77768 power amplifier module (pam) is a fully matched 10 - pad surface moun t module developed for wideband code division multiple access (wcdma) applications. this small and efficient module packs full 880- 915 mhz bandwidth coverage into a single compact package. because of high efficiencies attained throughout the entire power r ange, the sky 77768 delivers unsurpassed talk - time advantages. the SKY77768 meets the stringent spectral linearity requirements of high speed downlink packet access (hsdpa), high speed uplink packet access (hsupa), and long term evolution (lte) data transmission with high power added efficiency. an integrated directional coupler eliminates the need for any external coupler. the gallium arsenide (gaas) microwave monolithic integrated circuit (mmic) contains all amplifier active circuitry, including input and interstage matching circuits. the silicon cmos support die, providing precision biasing for the mmic affords a true cmos - compatible control interface. output match into a 50 - ohm load , realized off - chip within the module package , optimize s efficiency and po wer performance. the sky 77768 is manufactured with skyworks' ingap gaas heterojunction bipolar transistor (hbt) process which provides for all positive voltage dc supply operation and maintains high efficiency and good linearity. while primary bias to the sky 77768 can be supplied dire ctly from any suitable battery with an output of 3.2 v to 4.2 v, optimal performance is obtained with vcc2 sourced from a dc dc power supply adjusted w ithin 0.5 v to 3. 6 v based on target output power levels. power down executes by setting venable to zer o volts. no external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery. figure 1. sky 77768 functional block diagram www.bdtic.com/skyworks
electrical specifications the following tables list the electrical characteristics of the sky 77768 power amplifier. table 1 lists the absolute maximum ratings and table 2 shows the recommended operating conditions. electrical specifications for nominal operating conditions are listed in table 4. table 3 presents a truth table for the power settings. tables 5 through 8 provide the standard test configurations fo r wcdma (stc1) , hsdpa (stc2), and hsupa ( stc3, stc4) respectively. table 1 . absolute maximum operating conditions no damage assuming only one parameter set at limit at a time with all other parameters set at nominal value. parameter symbol minimum nominal maximum unit rf input power p in 0 10 dbm supply voltage no rf v cc1 v cc2 3.4 6.0 volts with rf 4.6 enable control voltage v en 1.8 4.2 volts mode control voltage v mode 0 1.8 4.2 volts v mode 1 1.8 4.2 case temperature 1 operating t case C 30 25 +110 c storage t stg C 40 + 150 1 case operating temperature (t case ) refers to the temperature of the ground pad at the underside of the package. table 2 . recommended operating conditions parameter symbol minimum nominal maximum unit rf output power 1 wcdma p out_max 28.50 dbm hsdpa 27.50 hsupa 24.85 lte 27.50 operating frequency ? o 880.0 897.5 915.0 mhz supply voltage v cc1 , v cc2 3.2 2 3.4 4.2 volts enable control voltage low v en _l 0.0 0.0 0.5 volts high v en _h 1.35 1.8 3.1 mode control voltage low v mode 0 0.0 0.0 0.5 volts v mode 1 0.0 0.0 0.5 high v mode 0 1.35 1.8 3.1 v mode 1 1.35 1.8 3.1 case operating temperature t case C 20 +25 +85 c 1 for v cc < 3.4 v, output power back - off = 0.5 db. 2 recommended minimum v cc for maximum power output is indicated. v cc2 down to 0.5 v may be used for backed - off power when using dc/dc converter to conserve battery current. 3 equivalent to C 30 c to +75 c a mbient operating temperature www.bdtic.com/skyworks
table 3 . modes of operation power setting enable vmode0 vmode1 vcc power down mode low low low on standby mode low on high power mode ( 17 .0 dbm p out 28.5 dbm ) high low on medium power mode ( 7.0 dbm p out 1 7 .0 dbm) high high low on low power mode (p out 7.0 dbm) high high high on table 4 . electrical specifications for nominal operating conditions per table 2 over dynamic range up to 28.5 dbm output power for stc1 modulation, unless otherwise specified. characteristics symbol condition minimum typical maximum unit gain 1 g low p out = 7.0 dbm v cc2 = 0.8 v 10 .0 14.0 21.5 db g med p out = 17.0 dbm v cc2 = 1.5 v 19.0 24.0 28.0 g high p out = 28.5 dbm 25.0 28.0 31.0 rx band gain rxg C 0.5 db rxg _gps C 3 .0 rxg _ism C 6 .0 power added efficiency pae low p out = 7.0 dbm 10.5 13.0 % pae med p out = 17 .0 dbm 22.0 26.5 pae high p out = 28.5 dbm 43.0 50 .0 total supply c urrent i cc_low p out = 7.0 dbm 44 55 ma i cc_ med p out = 17 .0 dbm 122 150 i cc_high p out = 28.5 dbm 420 500 quiescent current i q_ low low power mode 22 28 ma i q_med medium power mode 38 45 enable control current i en 20 40 a mode control current i mode 0 20 40 a i mode 1 20 40 total supply c urrent in power d own mode i pd v cc = 3.4 v v en = low v mode0 = low v mode1 = low 20 a i cc1 current i cc1_high 10 ma adjacent channel leakage power ratio 2 5 mhz offset aclr5 p out = 7.0 dbm C 43 C 40.0 dbc p out = 17.0 dbm C 45 C 40.0 p out = 28.5 dbm C 41 C 3 8 .5 10 mhz offset aclr10 p out = 7.0 dbm C 59 C 50.0 p out = 17.0 dbm C 56 C 50.0 p out = 28.5 dbm C 58 C 5 0.0 www.bdtic.com/skyworks
table 4. [continued] electrical specifications for nominal operating conditions per table 2 over dynamic range up to 28.5 dbm output power for stc1 modulation, unless otherwise specified. characteristics symbol condition minimum typical maximum unit adjacent channel leakage power ratio 3 eutra offset aclr _eutra p out (p out _max C mpr 4 ) C 40 dbc utra offset aclr1 _utra C 42 aclr2 _utra harmonic suppression second f 0 2 p out 28.5 dbm C 45 C 35 dbc third f 0 3 C 50 C 45 tx noise in rx bands 1 rx band 1 925 mhz C 960 mhz C 136 C 13 4 dbm/hz gps rx 1574 mhz C 1577 mhz C 140 ism rx 2400 mhz C 2483.5 mhz C 143 evm evm1 p out = p out_max 3.35 % evm2 p out = p out_max C 3 2.50 rise / fall time dc t on _dc 20 s t off _dc 20 rf t on _rf 6 t off _rf 6 coupling factor cpl p out = p out_max C 22 C 20 C 18 db cpl _out / p out power ratio variation over output vswr 2.5:1 vswr at p out all vswr phases cpl _in 50 ? terminated 0. 4 db daisy - chain vswr cpl _in and cpl _out ports 698 mhz to 2620 mhz v en = low 1.3:1 insertion loss cpl _in to cpl _out ports 698 mhz to 2620 mhz v en = low 0. 45 db input voltage standing wave ratio vswr 1.2:1 1.9 :1 stability (spurious output) 1 s 6:1 vswr all phases C 70 dbc ruggedness C no damage 1,5 ru p out 28.5 dbm 10:1 vswr 1 over conditions 2 aclr is expressed as a ratio of total adjacent power to wcdma modulated in - band, both measured in 3.84 mhz bandwid th at specified offsets. 3 lte: evm and aclr are measured with qpsk modulation with 1.4 mhz bandwidth and 5 resource blocks . (maximum power reduction = 0 dbm per 3gpp ts36.101. 4 mpr is the maximum power reduction as defined in 3gpp ts36.101 5 all phases, time = 10 seconds. www.bdtic.com/skyworks
table 5 . standard test configuration C stc1 wcdma mode parameter level spread code spread factor i/q c d hs ec ed relative power (db) dpcch 15 kbps 0 256 q 8/15 C 6.547 dpdch 60 kbps 16 64 i 15/15 C 1.087 table 6. standard test configuration C stc2 hsdpa mode parameter level spread code spread factor i/q c d hs ec ed relative power (db) dpcch 15 kbps 0 256 q 12/15 C 7.095 dpdch 60 kbps 16 64 i 15/15 C 5.157 hs - dpcch 15 kbps 64 256 q 24/15 C 3.012 table 7 . standard test configuration C stc 3 hsupa mode parameter level spread code spread factor i/q c d hs ec ed relative power (db) dpcch 15 kbps 0 256 q 8/15 C 19.391 dpdch 960 kbps 1 4 i 15/15 C 13.931 hs - dpcch 15 kbps 64 256 q 8/15 C 19.391 e - dpcch 15 kbps 1 256 i 10/15 C 17.338 e - dpdch 960 kbps 2 4 i 71.5/15 C 0.371 table 8 . standard test configuration C stc 4 hsupa mode parameter level spread code spread factor i/q c d hs ec ed relative power (db) dpcch 15 kbps 0 256 q 6/15 C 12.499 dpdch 960 kbps 1 4 i 15/15 C 4.540 hs - dpcch 15 kbps 64 256 q 2/15 C 22.041 e - dpcch 15 kbps 1 256 i 12/15 C 6.478 e - dpdch 960 kbps 2 4 i 15/15 C 4.425 www.bdtic.com/skyworks
evaluation board description the evaluation board is a platform for testing and interfacing design circuitry. to accommodate the interface testing of the sky 77768 , the evaluation board schematic and assembly diagrams are included for preliminary analysis and design. figure 2 shows the basic schematic of the board for the 880 mhz to 915 mhz range shown in figure 3 . figure 4 is a schematic of the recommended application shown in figure 5. figure 2 . evaluation board schematic figure 3 . eva luation board assembly diagram www.bdtic.com/skyworks
figure 4 . SKY77768 schematic for recommended application diagram figure 5 . SKY77768 recommended application diagram www.bdtic.com/skyworks
package dimensions the sky 77768 is a multi - layer lami nate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. figure 6 is a mechanical drawing of the pad layout for this package. figure 7 provides a recommended phone board layout footprint for the pam to help the designer attain optimum thermal conductivity, good grounding, and minimum rf discontinuity for the 50 - ohm terminals. figure 6. dimensional d iagram for 3 mm x 3 mm x 0 .9 mm package C sky 77768 specific www.bdtic.com/skyworks
figure 7 . phone pcb layout diagram C 3 mm x 3 mm , 10 - pad package C sky 77768 www.bdtic.com/skyworks
package description figure 8 shows the pad functions and the pad numbering convention, which starts with pad 1 in the upper left and increments counter - clockwise around the package. typical case markings are illustrated in figure 9. figure 8 . sky 77768 pad names and configuration (top view) figure 9 . typical case markings package handling information because of its sensitivity to moisture absorption, this device package is baked and vacuum - packed prior to shipment. instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. the sky 77768 is capable of withstanding an msl3/ 260 c solder reflow. care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. if the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 c per second; maximum temperature should not exceed 260 c. if the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 c for more than 10 seconds. for details on attachment techniques, precautions, and handling procedures recommended by skyworks, please refer to skyworks application note: pcb design and smt assembly/rework , document number 101752. additional information on standard smt reflow profiles can also be found in the jedec standard j - std - 020. production quantities of this product are shipped in the standard tape - and - reel format ( figure 10). electrostatic discharge (esd) sensitivity the sky 77768 meets class 1c jesd22 - a114 human body model (hbm), class iv jesd22 - c101 charged - device model (cdm), and class a jesd22 - a115 machine model (mm) electrostatic discharge (esd) sensitivity classification. to avoid esd damage, both latent and visible, it is very important that the product assembly and test areas follow the esd handling precautions listed below. ? personnel grounding - wrist straps - conductive smocks, gloves and finger cots - antistatic id badges ? protective workstation - dissipative table top - protective test equipment (properly grounded) - grounded tip soldering irons - solder conductive suckers - static sensors ? facility - relative humidity control and air ionizers - dissipative floors (less than 1 ,00 0 m ? to gnd) ? protective packaging and transport ation - bags and pouches (faraday shield) - protective tote boxes (conductive static shielding) - protective trays - grounded carts - protective work order holders www.bdtic.com/skyworks
figure 10. dimensional diagram for carrier tape body size 3 mm x 3 mm x 0.7 5 / 0.90 mm C mcm www.bdtic.com/skyworks
ordering information product name order number evaluation board part number sky 77768 power amplifier module sky 77768 - 11 en40 - d345 - 003 revision history revision date description a december 20, 2011 initial release C information b january 25, 2012 revise: figure 1; table 1 c march 9, 2012 revise: table 4 ; figures 2, 3 , 6 , 7 add: figures 4 , 5 d september 19, 2012 revise: figures 2 C 5 ; table s 2, 4; ordering information table (last page) e october 26, 2012 revise: change data sheet status from advance to final; table 4 ; ordering information table references skyworks application note: pcb design and smt assembly/rework, document number 101752. standard smt reflow profiles: jedec standard j C std C 020 electrostatic discharge sensitivity (esd) testing: jedec standard, jesd22 - a114 human body model (hbm) electrostatic discharge sensitivity (esd) testing: jedec standard, jesd22 - a115 machine model (mm) electrostatic discharge sensitivity (esd) testing: jedec standard, jesd22 - c101 charged device model (cdm). copyright ? 2011, 2012, skyworks solutions, inc. all rights reserved. information in this document is provided in connection with skyworks solutions, inc. (skyworks) products or services. these materials, including the information contained herein, are provided by skyworks as a service to its customers and may be used for informational purposes only by the customer. skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. skyworks may change its documentation, products, services, specifications or product descriptio n s at any time, without notice. skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. no license, whether exp ress, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of skyworks products, information or materials, except as may be provided in skyworks terms and conditions of sale. the materials, products and information are provided as is without warranty of any kind, whether express, implied, statutor y, or otherwise, i ncluding fitness for a particular purpose or use, merchantability, performance, quality or non - infringement of any intellectual property right; all such warranties are hereby expressly disclaimed. skyworks does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. skyworks shall not be liable for any damages, including but not limited to any special, indirect, incidental, statutory, or consequential damages, including without limitation, lost revenues or lost profits that may result from the use of the materials or information, whether or not the recipient of m aterials has been advised of the possibility of such damage. skyworks products are not intended for use in medical, lifesaving or life - sustaining applications, or other equipment in which the failure of the skyworks products could lead to personal injury, death, physical or environmental damage. skyworks customers using or selling skyworks products for use in such applications d o so at their own risk and agree to fully indemnify skyworks for any damages resulting from such improper use or sale. customers are responsible for their products and applications using skyworks products, which may deviate from published speci fications as a re sult of design defects, errors, or operation of products outside of published parameters or design specifications. customers should include design and operating safeguards to minimize these and other risks. skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of skyworks products outside of stated published specifications or parameters. skyworks, the skyworks symbol, breakthrough simplicity, dcr, helios, hip3, innovation to g o, intera, ipac, lipa, polar loop, and system smart are trademarks or registered trademarks of skyworks solutions, inc., in the united states and other countries. third - party brands and names are for identification purposes only, and are the property of their respective owners. additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. www.bdtic.com/skyworks

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